Einleitung
This guide will show how the motherboard for the IBM WorkPad c3 may be removed. This is a fairly simple process, once the rest of the WorkPad has been disassembled.
Werkzeuge
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Using a hair dryer, slowly heat the edges of the WorkPad.
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Spend at least one minute heating each side of the device. This will melt the glue holding the case together, and allow it to be removed.
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If the back case has already been removed, carefully place it on the WorkPad to protect the circuitry inside from the heat.
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Using the hair dryer, slowly heat the edges of the device. Spend at least 1 minute on each side, thoroughly heating the case.
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Using the Plastic Opening Tools, take the front of the case off.
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The power button at the top of the device will be loose once the front part of the case is removed.
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Using your thumb, press down gently on the back of the LCD.
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The LCD will disconnect and fall out of the case, so be sure to have your hand waiting for it.
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To reassemble your device, follow these instructions in reverse order.