Einleitung
Use this guide to replace a defective Headphone Jack.
Werkzeuge
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Insert plastic opening tool under back cover.
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Apply pressure on tool while using a downward motion to pop off back cover.
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Insert plastic opening tool under back cover.
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Pry the top cover upward to remove it from the phone.
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Insert plastic opening tool between back assembly and phone.
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Pry the back assembly away from phone.
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Insert the pointed end of a spudger into the gap in the round housing frame.
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Using spudger to remove vibrator remove from the adhesive.
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Insert the spudger under each corner ribbon cable and lift them out of the way.
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Insert a plastic pry tool into the gap between motherboard and base of phone
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Tilt the motherboard up carefully.
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Use a spudger to pry the connector from the socket on the motherboard.
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Lift motherboard from frame.
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Insert flat end of spudger between support panel and front assembly.
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Using a spudger pry up to create opening to insert plastic opening tool.
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Insert a plactic opening tool in opening.
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Use plastic opening tool to pry around the edge of support panel to free it from front assembly.
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Insert the pointed end of a spudger into gap.
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Lift spudger away from support plate to remove headphone component.
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Use the flat end of the spudger to remove headphone jack component from rectangular housing.
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To reassemble your device, follow these instructions in reverse order.