Einleitung

  1. tMKSNgEw1e163SZu
    tMKSNgEw1e163SZu
    ywJRqIIDTUEATq1J
    GeVtaQLJWjnSjAKc
    • The capacity of this iPhone is 64GB.

    • Remove the display, Disconnect the battery, and Remove the motherboard.

    How can I get the parts & supplies to actually pull this off?

    Tevin Bennett -

  2. ZXULhWvjQAK6XW23
    ZXULhWvjQAK6XW23
    bGl6X2aZfGC1GioV
    PhUiWZvCuCebWUMD
    • Attach the motherboard to the holder and then attach the high-temperature tape.

    • Heat the side of the NAND with Hot Air Gun at 280℃ and airflow 45.

  3. qFYEgB4yN6GDr3lK
    qFYEgB4yN6GDr3lK
    lCROHaUV3kix2GOX
    rLSfaG1qYBkxUG6K
    • Remove black adhesive on the side of the NAND with a Side Glue Cleaner Blade.

    • Heat the NAND with Hot Air Gun at 385℃ and airflow 45. Pry up the NAND with a Pry Knife

    • Apply medium temperature solder paste to the bonding pad with Soldering Iron at 365℃.

  4. qiuFB3KNbwZkX3TS
    qiuFB3KNbwZkX3TS
    LfkDEhhUPDIAQjGd
    JIt54tJZ2gtlJyR5
    • Apply a small amount of Paste Flux.

    • Remove tin on the bonding pad with Soldering Iron and Solder Wick.

    • Clean the bonding pad with PCB Cleaner.

  5. PlZsLlkptTU2CELR
    PlZsLlkptTU2CELR
    Sd5nSfSjpT2mmwmG
    EK1hKtbqyRS3jpkX
    • Heat the bonding pad with Hot Air Gun at 280℃ to remove the black adhesive.

    • Dip rosin with Soldering Iron and Solder Wick to remove tin on the bonding pad.

    • Clean the bonding pad with PCB Cleaner afterward.

  6. FKS5rw2NWQBbRbjx
    FKS5rw2NWQBbRbjx
    ZeIcQAttAYVpTGFZ
    Y2WolDdvQlHCHhQh
    • Apply some Paste Flux to the bonding pad and put an iPhone 12 256G NAND in position.

    • Solder the NAND with Hot Air Gun at 365℃ and airflow 45.

  7. BxRWSEo4Uy6EMKEE
    BxRWSEo4Uy6EMKEE
    mrnQS1kdkJRQjpKo
    Iy2C6nHyI3fGs2Ge
    • Install the motherboard and display. Plug in the data cable and connect the iPhone to the computer. Open 3uTools to flash the iPhone.

    • The phone does not display a progress bar during the flash process and won't display a progress bar until the flash has finished.

    • Activate the phone on 3uTools.

  8. 4Upm2cG5uICRNnSt
    4Upm2cG5uICRNnSt
    lylmxeI1a1wsktGT
    xNyngSl2ZycOtymE
    • Set up the phone and WiFi can be searched normally.

    • Go to Settings > About. The phone has a 256G capacity.

    • The serial number, WiFi address, and Bluetooth address remain unchanged.

Abschluss

It can be confirmed that the serial number, WiFi address, and Bluetooth address are no longer stored on the NAND. REWA technicians speculate that the serial number, WiFi address, and Bluetooth address are likely stored on EPROM or CPU. The technological change that Apple has made does make storage upgrade easier. But REWA doesn't recommend that users upgrade storage on their own. The first reason is that Apple does not provide a warranty for the phone that has been disassembled before. The second reason is that inappropriate operation may lead to some malfunctions. The water resistance function will be much worse. But for a phone with a bad NAND, it will be much easier to repair.

REWA

Mitglied seit: 24/11/20

11901 Reputation

3 Kommentare

will this work for iphone 12 pro?

Anwesh -

If you have the right flash chip.

Duck -

whats the 256gb NAND ic no

ctrack -