Einleitung
The iPhone 6 launched last week - and is already out of stock! In preparation to the iPhone 6 teardown, we went ahead with the teardown by x-ray of the Apple iPhone 5S.
Before we begin, let's take a look at the 5s specs.
- Apple A7 processor with 64-bit architecture.
- M7 motion co-processor.
- 16, 32, or 64 GB Storage.
- 4-inch retina display with 326 ppi.
- 8 MP iSight camera (with larger 1.5µ pixels) and a 1.2MP FaceTime camera.
- Fingerprint identity sensor built into the home button.
- Available in three different colors: space gray, silver, and gold.
The iPhone 5S we x-ray inspected is a white device with 16GB of memory. The x-ray inspection was done without removing any parts of the phone - we didn't even power it off!
Looks good on the outside, now let's take a look inside.
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We are going to take a look inside an iPhone 5s using a high resolution x-ray inspection system - the TruView 200. This system packs an impressive 130kV microfocus source and a large 3"x4" x-ray sensor capable of delivering 1um resolution.
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For more information about the system we used please visit TruView Number Series.
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Now it's time to start the x-ray inspection!
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1.2MP FaceTime camera.
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8 MP iSight camera (with larger 1.5µ pixels).
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Yellow: Apple A7 processor with 64-bit architecture
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This iPhone 5S has a 3.8V - 5.92Wh - 1560 mAh battery. Not much improvement from the iPhone 5 3.8 V - 1440 mAh - 5.45 Wh. Talk time: Up to 8 hours on 3G. Standby time: Up to 225 hours.
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Speaker
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Lightning connector and Touch ID interface
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3.5mm audio jack
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Here's some of the powertrain in the iPhone 5S:
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Apple 338S120L.
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Qualcomm PM8018 RF power management IC and Qualcomm MDM9615M LTE Modem
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Qualcomm WTR1605L LTE/HSPA+/CDMA2K/TDSCDMA/EDGE/GPS transceiver.
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Avago A790720
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We know voids in ball grid arrays (BGA) can be problematic to the reliability of any electronic product. In our x-ray inspection of the iPhone 5S, we noticed that the Apple 338S120L chipset had a large number of voids. So the natural next step was to use the BGA inspector included in the TruView 200 to measure the voids.
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A quick analysis of the BGA voiding in the Apple 338S120L shows voids as large as 35%. That does not mean this is a problem, but certainly something a quality manager would need to check and validate. Besides, none of the other surface mount components in the iPhone 5S have this level of voiding.
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The BGA inspector allows us to visualize the void in a 3D representation of x-y and density as the height of the volume.
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Closer look... the iPhone 5s iSight Camera has 8 megapixels of fun, autofocus and auto HDR for photos, among other features.
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Size wise its not much different than the Camera on the iPhone 5.
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This corner shot of the iPhone 5S shows the standard 3.5mm audio jack. You can also see the corner of the Touch ID interface and supporting mechanics.
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Here's a detail image of the Touch ID sensor. Note that it sits on top of the Lightning connector, that's why you see them overlaid in this x-ray image.
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This corner of the iPhone 5S has not changed since the iPhone 5/4S. The large high performance speaker is located in the same place, and the antennae connections are very similar to previous models.
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2 Kommentare
Jajajaja que es lo que no entiendes para poder ayudarte?
Nelson -
Como ago funcionar mi 5s