Introduction
prereq battery disconnect
Tools
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Apply a heated iOpener to the rear glass to loosen the adhesive beneath the edges. Apply the iOpener for at least two minutes.
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Secure a suction handle to the lower edge of the rear glass, as close to the edge as possible.
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Lift the rear glass with the suction handle to create a gap between the glass and the frame.
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Insert an opening pick into the gap.
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Slide the opening pick to the bottom right corner of the phone.
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Insert a second opening pick and slide it to the bottom left corner to cut the adhesive.
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Leave the opening picks in place to prevent the adhesive from resealing.
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Insert a third opening pick at the bottom left corner.
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Start to slide the opening pick from the bottom left corner along the side of the Xiaomi Mi 8 to cut the adhesive.
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As the adhesive cools down it gets harder to cut. If necessary use your iOpener to reheat it.
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Leave the opening pick in the top left corner to prevent the adhesive from resealing.
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Insert a fourth opening pick under the top left corner of the rear glass.
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Slide the opening pick along the top to cut the adhesive.
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Leave the opening pick in the top right corner to prevent the adhesive from resealing.
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Insert a fifth opening pick at the top right corner of the phone.
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Slide the opening pick along the right edge to cut the remaining adhesive.
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Carefully lift the rear glass and fold it to the left side to access the fingerprint flex connector.
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Remove the ten screws that secure the motherboard cover.
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Eight Phillips #00 screws (3.4 mm length)
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Two Phillips #00 screws (3.5 mm length)
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Slide an opening pick under the right side of the motherboard cover.
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Twist the opening pick sideways to pry up and slightly lift the motherboard cover.
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Use a spudger to pry up and disconnect the battery flex cable located at the bottom of the motherboard.
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To reassemble your device, follow these instructions in reverse order.