Xiaomi Mi 8 Motherboard Cover with NFC Replacement

Written By: Dominik Schnabelrauch

Comments: 3

Xiaomi Mi 8 Motherboard Cover with NFC Replacement

Difficulty

Moderate

Steps

Time Required

25 - 45 minutes

Introduction

Use this guide to remove or replace the motherboard cover in the Xiaomi Mi 8 including the NFC antenna.

You’ll need replacement adhesive to reattach components when reassembling the device.

Tools

Step 1

Apply a heated iOpener to the rear glass to loosen the adhesive beneath the edges. Apply the iOpener for at least two minutes.

Step 2

Secure a suction handle to the lower edge of the rear glass, as close to the edge as possible.
If the phone's rear glass is cracked, the suction handle may not stick. Try lifting it with strong tape, or superglue the suction handle in place and allow it to cure so you can proceed.
Lift the rear glass with the suction handle to create a gap between the glass and the frame.
Insert an opening pick into the gap.
If the glass wont budge, apply more heat to further soften the adhesive. Follow the iOpener instructions to avoid overheating.
Slide the opening pick to the bottom right corner of the phone.

Step 3

Insert a second opening pick and slide it to the bottom left corner to cut the adhesive.
Leave the opening picks in place to prevent the adhesive from resealing.

Step 4

Insert a third opening pick at the bottom left corner.
Start to slide the opening pick from the bottom left corner along the side of the Xiaomi Mi 8 to cut the adhesive.
Be aware of the fingerprint flex cable and only insert the tip of the opening pick. If insert to deep, you can cut the cable by accident.
As the adhesive cools down it gets harder to cut. If necessary use your iOpener to reheat it.
Leave the opening pick in the top left corner to prevent the adhesive from resealing.

The back cover of MI 8 easily breaks while sliding the opening pick because it is made of fragile glass. Before sliding the pick, rim of the back cover should be heated enough to make adhesive loose.

Shunsuke Abe - 06/06/21

Step 5

Insert a fourth opening pick under the top left corner of the rear glass.
Slide the opening pick along the top to cut the adhesive.
Leave the opening pick in the top right corner to prevent the adhesive from resealing.

Step 6

Insert a fifth opening pick at the top right corner of the phone.
Slide the opening pick along the right edge to cut the remaining adhesive.
Don't try to remove the rear glass all the way yet. The fingerprint flex cable is still connected to the motherboard.

Step 7

Carefully lift the rear glass and fold it to the left side to access the fingerprint flex connector.

Step 8

Use a spudger to pry up and disconnect the fingerprint flex cable.
Remove the rear glass.
Before installing new adhesive for reassembly, remove any remaining adhesive from the phone, and clean the glued areas with isopropyl alcohol and a lint-free cloth.
After installing the rear glass, apply pressure for several minutes to help the adhesive form a good bond. A stack of heavy books on top of the phone works well.

Step 9

Remove the ten screws that secure the motherboard cover.
Eight Phillips #00 screws (3.4 mm length)
Two Phillips #00 screws (3.5 mm length)

Bei dem MI 8 ist (auf dem Bild gesehen) unten links noch eine Schraube (3,4 mm #00 Kreuzschlitzschraube) die zum Entfernen des Motherboards gelöst werden muß

Jürgen Dreßler - 15/09/20

Hallo Jürgen, danke für den Hinweis. Die Schraube wurde übersehen und ich habe den Schritt entsprechend angepasst.

Dominik Schnabelrauch - 17/09/20

Step 10

Slide an opening pick under the right side of the motherboard cover.
Twist the opening pick sideways to pry up and slightly lift the motherboard cover.