Einleitung
This is a prerequisite-only guide! This guide is part of another procedure and isn't meant to be used alone.
Werkzeuge
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Apply a suction cup to the back of the phone, as close to the bottom left corner as possible.
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Pull up on the suction cup with a strong, steady force to create a gap between the back cover and the midframe on the left edge.
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Insert an opening pick into the gap.
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Slide the pick along the left edge of the phone to slice the adhesive securing the back cover to the frame.
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Leave the pick inserted in the top left corner to prevent the adhesive from resealing.
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Slide the pick along the top edge to slice the adhesive.
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Leave the opening pick inserted in the top right corner to prevent the adhesive from resealing.
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Slide the pick along the right edge to slice the adhesive.
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Leave the pick inserted in the bottom right corner to prevent the adhesive from resealing.
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There's a significant amount of adhesive to the right of the cameras that secures the back cover to the motherboard cover.
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Apply a heated iOpener to the right of the cameras for two minutes.
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Insert an opening pick between the back cover and motherboard cover on the top right edge.
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Gently pull up on the back cover while sliding the opening pick back and forth along the right side of the cameras to slice the adhesive.
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Lift the back cover from the phone and remove it.
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This is a good point to test your phone's functionality before sealing it up. Use this guide to run a hardware test. Be sure to power your phone back down completely before you continue working.
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Follow this guide to replace the back cover adhesive.
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Insert a spudger between the motherboard cover and midframe on the top right edge of the phone.
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Pry up with the spudger to release the clips securing the motherboard cover.
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To reassemble your device, follow these instructions in reverse order.