Einleitung
This is a prerequisite-only guide! This guide is part of another procedure and isn't meant to be used alone.
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Apply a suction cup to the back cover, as close to the center of the left edge as possible.
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Pull up on the suction cup with strong, steady force to create a gap between the cover and the frame.
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Insert an opening pick into the gap.
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Slide your opening pick back and forth along the left edge to slice through the adhesive.
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Leave the pick in at the bottom left corner to prevent the adhesive from resealing.
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Insert and slide a second opening pick to the bottom right corner to slice through the adhesive.
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Leave the pick inserted to prevent the bottom edge from resealing.
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Repeat this process for the right and top edges of the cover.
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Grab and lift the bottom edge of the cover.
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As you lift the back cover, press and unstick the fingerprint reader from it.
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Grab and remove the back cover.
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This is a good point to test your phone before sealing it up. Follow this guide to perform a hardware test. Be sure to power your phone back down completely before you continue working.
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To adhere the back cover with custom-cut adhesives, follow this guide.
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To adhere the back cover with tape, follow this guide.
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Use your Phillips screwdriver to remove the twelve 3.9 mm-long screws securing the motherboard cover.
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Insert the pointed end of a spudger between the bottom right corner of the motherboard cover and the frame.
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Pry the cover upward until you can grab it with your fingers.
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To reassemble your device, follow these instructions in reverse order.
